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首页> 外文期刊>Applied Surface Science >Optimization of the buffer surface of CoFeB/MgO/CoFeB-based magnetic tunnel junctions by ion beam milling
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Optimization of the buffer surface of CoFeB/MgO/CoFeB-based magnetic tunnel junctions by ion beam milling

机译:通过离子束铣削优化基于CoFeB / MgO / CoFeB的磁性隧道结的缓冲表面

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摘要

Due to their high tunnel magnetoresistance (TMR) ratios at room temperature, magnetic tunnel junctions(MTJs) with a crystalline MgO insulating barrier and CoFeB ferromagnetic (FM) layers are the best candidates for novel magnetic memory applications. To overcome impedance matching problems in electronic circuits, the MgO barrier must have an ultra-low thickness (similar to 1 nm). Therefore, it is mandatory to optimizethe MTJ fabrication process, in order to prevent relevant defects in the MgO barrier that could affect the magnetic and electrical MTJ properties. Here, a smoothing process aiming to decrease the roughness of the buffer surface before the deposition of the full MTJ stack is proposed. An ion beam milling process was used to etch the surface of an MTJ buffer structure with a Ru top layer. The morphologic results prove an effective decrease of the Ru surface roughness with the etching time. The electrical and magnetic results obtained for MTJs with smoothed buffer structures show a direct influence of the buffer roughness and coupling field on the improvement of the TMR ratio. (C) 2017 Elsevier B.V. All rights reserved.
机译:由于它们在室温下具有较高的隧道磁阻(TMR)比率,因此具有结晶MgO绝缘势垒和CoFeB铁磁(FM)层的磁隧道结(MTJ)是新型磁存储应用的最佳候选者。为了克服电子电路中的阻抗匹配问题,MgO势垒必须具有极低的厚度(类似于1 nm)。因此,有必要优化MTJ的制造工艺,以防止MgO势垒中可能影响MTJ磁性和电气特性的相关缺陷。在此,提出了旨在在整个MTJ叠层的沉积之前减小缓冲表面的粗糙度的平滑工艺。离子束铣削工艺用于蚀刻具有Ru顶层的MTJ缓冲结构的表面。形态学结果证明Ru表面粗糙度随蚀刻时间有效降低。对于具有平滑缓冲结构的MTJ,所获得的电磁结果表明,缓冲粗糙度和耦合场对TMR比的提高具有直接影响。 (C)2017 Elsevier B.V.保留所有权利。

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