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Thermoelectric properties of Sn doped BiCuSeO

机译:Sn掺杂BiCuSeO的热电性能

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BiCuSeO and Bi(1-x)Sn(x)CuSeo (x = 0.02, 0.04, 0.06, 0.08) were prepared by a two-step solid state synthesis. The phase purity and the crystal structure were investigated by the X-Ray Diffraction (XRD) and confirmed by Energy Dispersive Spectroscopy (EDS). The volatilization of Bi and Bi2O3 lead to off-stoichiometry of the main phase and the formation of CuSe2 secondary phase in the undoped sample. SnO2 secondary phases were found in the doped samples. Both the Seebeck coefficient and the electrical resistivity, measured from the room temperature to 773 K linearly increases with the temperature, which indicates that the sample have metallic like behavior. The origin of such a behavior is due to high hole concentration originating from the Bi and the O vacancies. The Sn +4 valence state was confirmed from the X-Ray Photoelectron Spectroscopy (XPS) and from the reduction of lattice parameter 'a' with doping. The substitution of Sn+4 in the place of Bi+3 leads to the higher Seebeck coefficient and electrical resistivity in the doped samples. Highest power-factor (similar to 1 mW/m-K-2 at 773 K), was obtained for the undoped sample and the 4% Sn doped sample(Bi0.96Sn0.04CuSeO). The lowest thermal conductivity was obtained for the undoped sample, from the room temperature to 773 K. The presence of thermally-conducting SnO2 secondary phases in the doped samples increases the thermal conductivity in comparison with the undoped sample. The zTs of the doped samples were lower compared to the undoped sample, owing to their higher thermal conductivity. The oxygen vacancies as well as the all-length scale phonon scattering, lowers the thermal conductivity of the undoped sample and, as a result, a maximum zT of 1.09 was achieved at 773 K. (C) 2016 Elsevier B.V. All rights reserved.
机译:通过两步固态合成制备了BiCuSeO和Bi(1-x)Sn(x)CuSeo(x = 0.02、0.04、0.06、0.08)。通过X射线衍射(XRD)研究相纯度和晶体结构,并通过能量色散谱(EDS)确认。 Bi和Bi2O3的挥发会导致未掺杂样品中主相的化学计量失误并形成CuSe2次要相。在掺杂样品中发现了SnO2第二相。从室温到773 K的塞贝克系数和电阻率都随温度线性增加,这表明样品具有类似金属的行为。这种行为的根源是由于Bi和O空位引起的高空穴浓度。从X射线光电子能谱(XPS)以及掺杂引起的晶格参数'a'的减少可以确认Sn +4价态。用Sn + 4代替Bi + 3会导致掺杂样品中更高的塞贝克系数和电阻率。对于未掺杂的样品和4%的Sn掺杂样品(Bi0.96Sn0.04CuSeO),获得了最高的功率因数(在773 K下类似于1 mW / m-K-2)。从室温到773 K,未掺杂样品的导热系数最低。与未掺杂样品相比,掺杂样品中导热SnO2二次相的存在增加了导热系数。掺杂样品的zTs比未掺杂样品的zT低,因为它们的热导率更高。氧空位以及全长标尺的声子散射会降低未掺杂样品的热导率,结果在773 K处实现最大zT为1.09。(C)2016 Elsevier B.V.保留所有权利。

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