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首页> 外文期刊>IEEE Transactions on Applied Superconductivity >Conductor architecture, filamentary interconnections and currentdistribution in BiSCCO-2223-based tape conductors
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Conductor architecture, filamentary interconnections and currentdistribution in BiSCCO-2223-based tape conductors

机译:基于BiSCCO-2223的带状导体中的导体架构,丝状互连和电流分布

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摘要

The transport properties of superconducting interconnections in multifilamentary Bi2Sr2Ca2Cu3O10 /Ag-alloy tapes are analyzed. A simple experimental procedure is developed to assess the interconnections in a direct and quantitative way. Distinct behavior was observed for tapes produced in different conditions. Results of the transport measurements are consistent with the tape microstructure
机译:分析了多丝Bi2Sr2Ca2Cu3O10 / Ag合金带中超导互连的传输特性。开发了一种简单的实验程序,以直接和定量的方式评估互连。对于在不同条件下生产的胶带,观察到了不同的行为。传输测量结果与胶带的微观结构一致

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