Thermal analysis of a part of circuit board card by the photothermal deflection technique

摘要

Photothermal deflection which is a nondestructive technique is widely used to study defects in materials. However, high spatial resolution and high sensitivity are required to detect them. To validate the theoretical model that we developed in the case, the sample is immersed in a paraffin oil-filled cell and heated with a laser beam of a diameter less than the dimensions of defects and of power 2 mW instead of several 100 mW power frequently used. Our model was tested on a part of a circuit board card having copper strips spaced periodically and embedded in the resin. The experimental curves of amplitude and phase variations according to displacement of the sample are in good agreement with the corresponding theoretical ones; and their coincidence permit us to deduce several parameters such as the width of the copper and resin strips, their thicknesses and their thermal properties. These comparisons allowed also to detect some anomalies in the structure such as inhomogeneity in the width, the shape and the thicknesses of copper and resins strips.