Wireless pad-free integrated circuit debugging by powering modulation and lock-in infrared sensing

摘要

In this work, non-functional radio frequency identification pad-free chips are analyzed by modulating its powering scheme and noninvasively sensing their surface infrared (IR) emission with an IR camera following lock-in strategies. This approach is justified by the chip wireless powering strategy and its pad-free design. As a result, latch-up triggering has been identified as the failure mechanism, also showing that electrical figures of merit can be extracted non-invasively (i.e., coils coupling frequency and its bandwidth).