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Effects of ZrO2 doping on HfO2 resistive switching memory characteristics

机译:ZrO 2 掺杂对HfO 2 电阻开关记忆特性的影响

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摘要

A resistive switching (RS) random access memory device with ZrO2-doped HfO2 exhibits better RS performance than that with pure HfO2. In particular, Ires, Vres, and Vset are reduced by approximately 58%, 38%, and 39%, respectively, when HfO2 is doped with ZrO2 (9 at. %). In addition, the ZrO2 doping in HfO2 makes the distribution of most parameters steeper. Transmission electron microscopy (TEM) analysis reveals that the deposited zirconium-doped hafnium oxide (HZO) (9 at. %) is polycrystalline. Elemental mapping results by scanning TEM–energy dispersive spectroscopy also prove that ZrO2 is uniformly distributed in the HZO (9 at. %) film. The possible mechanism for the improvement in the RS characteristics is also suggested on the basis of the X-ray photoelectron spectroscopy results and filamentary RS mechanism. These results suggest that the ZrO2 doping into HfO2 likely not only will reduce power consumption but also will improve cyclic endurance by controlling the nonstoichiometric phase.
机译:掺有ZrO 2 的HfO 2 的电阻开关(RS)随机存取存储设备比纯HfO 2 的RS性能更好。特别是,当 res ,V res 和V set 减小时,分别减小约58%,38%和39%。 HfO 2 掺杂了ZrO 2 (9 at。%)。此外,HfO 2 中的ZrO 2 掺杂使大多数参数的分布更加陡峭。透射电子显微镜(TEM)分析表明,沉积的掺杂锆的氧化ha(HZO)(9原子%)是多晶的。通过扫描TEM-能量色散光谱进行的元素标测结果也证明ZrO 2 均匀地分布在HZO(9 at。%)膜中。根据X射线光电子能谱结果和丝状RS机理,还提出了改善RS特性的可能机理。这些结果表明,将ZrO 2 掺杂到HfO 2 中不仅可以降低功耗,而且可以通过控制非化学计量相来提高循环寿命。

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