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Reduced annealing temperature for ferroelectric HZO on InAs with enhanced polarization

机译:降低极化后的InAs上铁电HZO的退火温度

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摘要

Deposition, annealing, and integration of ferroelectric Hf_xZr_(1-x)O_2 (HZO) thin films on the high-mobility semiconductor InAs using atomic layer deposition are investigated. Electrical characterization reveals that the HZO films on InAs exhibit an enhanced remanent polarization compared to films formed on a reference TiN substrate, exceeding 20 μC/cm~2 even down to an annealing temperature of 370℃. For device applications, the thermal processes required to form the ferroelectric HZO phase must not degrade the high-κ/InAs interface. We find by evaluation of the capacitance-voltage characteristics that the electrical properties of the high-κ/InAs are not significantly degraded by the annealing process, and high-resolution transmission electron microscopy verifies a maintained sharp high-κ/InAs interface.
机译:利用原子层沉积技术研究了高迁移率半导体InAs上铁电Hf_xZr_(1-x)O_2(HZO)薄膜的沉积,退火和集成。电学特征表明,与在参考TiN衬底上形成的膜相比,InAs上的HZO膜表现出增强的剩余极化,甚至低至370℃的退火温度也超过20μC/ cm〜2。对于器件应用,形成铁电HZO相所需的热处理不得降低高κ/ InAs界面。通过对电容-电压特性的评估,我们发现高κ/ InAs的电性能不会因退火过程而显着降低,而高分辨率透射电镜证实了高κ/ InAs界面的尖锐性。

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