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Interaction between interstitials and arsenic-vacancy complexes in crystalline silicon

机译:晶体硅中的间隙与砷空位络合物之间的相互作用

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摘要

Using density functional theory calculations, we have examined the interaction of interstitials with various arsenic-vacancy complexes and compared these events to interstitial-vacancy (I-V) interactions. We find that the vacancy of As_(m)V (m=1-4) and As_(m)V_(2) (m=2,3) complexes is easily annihilated by I-V recombination, with barriers of 0-0.08 eV and 0.16-0.21 eV, respectively, for the mono- and the di-vacancy associated complexes. The energy gain from the I-V recombination turns out to be significant (>1.3 eV), implying that As would remain more favorably as As_(n) (or As_(m)I_(n)) complexes, rather than as As_(m)V_(n) in the presence of a large amount of excess interstitials. This suggests that interstitials may play an important role in As transient enhanced diffusion and agglomeration, especially at the early stage of postimplantation thermal annealing. We present the reaction paths and bonding mechanisms for the vacancy annihilation of V_(n) and As_(m)V_(n) clusters by I-V recombination.
机译:使用密度泛函理论计算,我们检查了间隙与各种砷-空位配合物的相互作用,并将这些事件与间隙-空位(I-V)相互作用进行了比较。我们发现,通过IV重组很容易消除As_(m)V(m = 1-4)和As_(m)V_(2)(m = 2,3)复合物的空位,其势垒为0-0.08 eV和单空位和双空位相关的配合物分别为0.16-0.21 eV。通过IV重组获得的能量收益显着(> 1.3 eV),这意味着As会以As_(n)(或As_(m)I_(n))的络合物而不是As_(m)的络合物更有利地保留V_(n)存在大量多余的插页式广告。这表明间隙可能在As瞬态增强扩散和团聚中起重要作用,尤其是在植入后热退火的早期阶段。我们提出了通过I-V重组V_(n)和As_(m)V_(n)簇的空位an灭的反应路径和键合机制。

著录项

  • 来源
    《Applied Physics Letters》 |2004年第21期|p.4935-4937|共3页
  • 作者单位

    Department of Chemical Engineering, University of Texas, Austin, Texas 78713;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 应用物理学;
  • 关键词

  • 入库时间 2022-08-18 03:23:30

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