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Change in the chemical state and thermal stability of HfO_(2) by the incorporation of Al_(2)O_(3)

机译:通过掺入Al_(2)O_(3)改变HfO_(2)的化学状态和热稳定性

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摘要

Al_(2)O_(3) incorporated HfO_(2) films grown by atomic layer deposition were investigated using various measurement tools. The accumulation capacitance of the Al_(2)O_(3) incorporated into HfO_(2) film increases as the postannealing temperature increases because of changes in interfacial and upper layer thickness and in interfacial stoichiometry. The core-level energy state of a 15 A thick film shows a shift to higher binding energy, as the result of silicate formation and Al_(2)O_(3) incorporation. The incorporation of Al_(2)O_(3) into the HfO_(2) film has no effect on silicate formation at the interface between the film and Si, while the ionic bonding characteristics and hybridization effects are enhanced compared to a pure HfO_(2) film. Any dissociated Al_(2)O_(3) on the film surface is completely removed by a vacuum annealing treatment over 850℃, while HfO_(2) contributes to Hf silicide formation on the surface of the film.
机译:使用各种测量工具研究了通过原子层沉积生长的Al_(2)O_(3)并入HfO_(2)膜。 HfO_(2)膜中所含的Al_(2)O_(3)的累积电容随着界面温度和上层厚度以及界面化学计量的变化而随着退火后温度的升高而增加。 15 A厚膜的核心能级状态显示为向更高的结合能转移,这是硅酸盐形成和Al_(2)O_(3)结合的结果。将Al_(2)O_(3)掺入HfO_(2)膜中对膜与Si之间的界面处的硅酸盐形成没有影响,而与纯HfO_(2)相比,离子键合特性和杂化效果得到增强)电影。膜表面上任何离解的Al_(2)O_(3)通过850℃以上的真空退火处理都可以完全去除,而HfO_(2)有助于在膜表面形成Hf硅化物。

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