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Enhanced quantum efficiency of high-purity silicon imaging detectors by ultralow temperature surface modification using Sb doping

机译:通过使用Sb掺杂进行超低温表面改性提高了高纯度硅成像探测器的量子效率

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A low temperature process for Sb doping of silicon has been developed as a backsurface treatment for high-purity n-type imaging detectors. Molecular beam epitaxy (MBE) is used to achieve very high dopant incorporation in a thin, surface-confined layer. The growth temperature is kept below 450℃ for compatibility with Al-metallized devices. Imaging with MBE-modified 1k X 1k charge coupled devices (CCDs) operated in full depletion has been demonstrated. Dark current is comparable to the state-of-the-art process, which requires a high temperature step. Quantum efficiency is improved, especially in the UV, for thin doped layers placed closer to the backsurface. Near 100% internal quantum efficiency has been demonstrated in the ultraviolet for a CCD with a 1.5 nm silicon cap layer.
机译:已经开发出用于硅的Sb掺杂的低温工艺,作为用于高纯度n型成像检测器的背面处理。分子束外延(MBE)用于在表面受限的薄层中实现很高的掺杂剂掺入。生长温度保持在450℃以下,以与Al金属化器件兼容。已经证明了使用完全耗尽的MBE修饰的1k X 1k电荷耦合器件(CCD)进行成像。暗电流可与需要高温步骤的最新工艺媲美。对于靠近背面的薄掺杂层,量子效率得到了改善,尤其是在紫外线中。对于具有1.5 nm硅盖层的CCD,在紫外线中已证明了近100%的内部量子效率。

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