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Suppression of DC bias stress-induced degradation of organic field-effect transistors using postannealing effects

机译:利用后退火效应抑制直流偏置应力引起的有机场效应晶体管的降解

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摘要

We fabricate pentacene field-effect transistors (FETs) showing a very small degradation in performance under a continuous DC bias stress. Pentacene FETs are manufactured on polyimide films with polyimide gate dielectric layers, and then encapsulated by poly-chloro-para-xylylene passivation layers, resulting in very flexible and heat-resistant devices. When such devices are annealed at 140℃ for 12 h in a nitrogen environment, the change in their source-drain current is 3±1% even after the application of continuous DC voltage biases of V_(DS)=V_(GS)=-40 V for 11 h. Furthermore, their mobility is increased by postannealing effects from 0.27 cm~2/V s to 0.36 cm~2/V s and their on/off ratio is also increased from 10~3 to 10~6.
机译:我们制造的并五苯场效应晶体管(FET)在连续的直流偏置应力下表现出很小的性能下降。并五苯FET是在具有聚酰亚胺栅极电介质层的聚酰亚胺薄膜上制造的,然后用聚氯对亚二甲苯基钝化层封装,从而获得了非常灵活且耐热的器件。当此类器件在氮气环境中于140℃退火12小时时,即使施加了连续的直流电压V_(DS)= V_(GS)=-,其源极-漏极电流的变化也为3±1%。 40 V持续11 h。此外,它们的迁移率通过后退火效应从0.27 cm〜2 / V s增加到0.36 cm〜2 / V s,并且其开/关比也从10〜3增加到10〜6。

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