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Evidence of the C_(60)/Cu contact formation after thermal treatment

机译:热处理后形成C_(60)/ Cu接触的证据

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The origin of the lowered electron injection barrier height of C_(60)/Cu was investigated by in situ ultraviolet photoelectron spectroscopy and x-ray photoelectron spectroscopy (XPS). The onset of the highest occupied molecular orbital level was shifted by 0.2 eV toward high binding energy upon the heat treatment, resulting in the improved injection characteristics of the device. Moreover, an unexpected gap state has been observed at 1.2 eV below the Fermi level. The XPS core-level spectra revealed that the chemical reaction between C_(60) and Cu at the interface induced the gap state after heat treatment. The gap state pinned the Fermi level close to the lowest unoccupied molecular orbital of C_(60). We obtained the complete energy level diagram of C_(60)/Cu before and after the heat treatment.
机译:通过原位紫外光电子能谱和X射线光电子能谱(XPS)研究了C_(60)/ Cu的电子注入势垒高度降低的原因。热处理时,最高占据分子轨道能级的开始朝着高结合能移动了0.2 eV,从而改善了器件的注入特性。此外,在费米能级以下1.2 eV处观察到了意外的间隙状态。 XPS核心能级谱表明,热处理后C_(60)与Cu之间的化学反应引起了间隙状态。间隙状态将费米能级固定在C_(60)的最低未占据分子轨道附近。我们获得了热处理前后C_(60)/ Cu的完整能级图。

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