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首页> 外文期刊>Applied Physics Letters >Carrier injection and transport characteristics of copper phthalocyanine thin films under low to extremely high current densities
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Carrier injection and transport characteristics of copper phthalocyanine thin films under low to extremely high current densities

机译:电流密度低至极高时铜酞菁薄膜的载流子注入和传输特性

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摘要

We investigated current density-voltage (J-V) characteristics of copper phthalocyanine (CuPc) thin films depending on active device areas. We prepared CuPc thin-film devices with active areas smaller than S=625 μm~2 using a photolithography technique. The maximum breakdown current density (J_(MAX)) and voltage (V_(MAX)) of the devices markedly increased as the active area was decreased from S=625 to 7.9 μm~2. In the smallest device, with S=7.9 μm~2, we obtained not only an extremely high current density of J_(MAX)=128 kA/cm~2 at V_(MAX)=9.2 V, but also unique J-V characteristics, indicating that the carrier conduction process shifted from the Fowler-Nordheim tunneling injection mechanism to shallow-trap' and trap-free space-charge-limited current mechanisms.
机译:我们研究了取决于有源器件面积的铜酞菁(CuPc)薄膜的电流密度-电压(J-V)特性。我们采用光刻技术制备了有源区小于S = 625μm〜2的CuPc薄膜器件。随着有效面积从S = 625减小到7.9μm〜2,器件的最大击穿电流密度(J_(MAX))和电压(V_(MAX))显着增加。在最小的器件中,S = 7.9μm〜2,我们不仅获得了V_(MAX)= 9.2 V时极高的电流密度J_(MAX)= 128 kA / cm〜2,而且还获得了独特的JV特性,这表明载流子传导过程从Fowler-Nordheim隧穿注入机制转变为浅陷阱和无陷阱的空间电荷限制电流机制。

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