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Reliability properties of metal-oxide-semiconductor capacitors using HfO_2 high-κ dielectric

机译:使用HfO_2高介电常数的金属氧化物半导体电容器的可靠性

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摘要

Metal-oxide-semiconductor capacitors with atomic layer deposited HfO_2 dielectric were fabricated. The charge-to-breakdown (Q_(BD)) characteristics of the metal-oxide-semiconductor structure were investigated. The Weibull slopes β with thicknesses of 9.12, 8.2, and 6.51 nm are 3.42, 2.90, and 1.83, respectively. Using the cell-based analytic model, the defect sizes a_0 were extracted to be about 0.98 and 1.64 nm for exponent σ values of 0.6 and 1, respectively. A comparison with conventional SiO_2-gated capacitors was made.
机译:制备了原子层沉积的HfO_2电介质的金属氧化物半导体电容器。研究了金属氧化物半导体结构的电荷击穿(Q_(BD))特性。厚度为9.12、8.2和6.51nm的威布尔斜率β分别为3.42、2.90和1.83。使用基于单元的分析模型,对于指数σ值分别为0.6和1,缺陷大小a_0分别提取为约0.98和1.64 nm。与传统的SiO_2门控电容器进行了比较。

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