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Electrical transport properties of wafer-fused p-GaAs-GaN heterojunctions

机译:晶片融合的p-GaAs / n-GaN异质结的电传输特性

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GaAs/GaN pn heteroj unction diodes have been fabricated by direct wafer fusion and characterized by capacitance-voltage (C-V) measurements and temperature dependent current-voltage (I-V) measurements. The wafer-fused pn diode showed a good rectifying behavior, but a small turn-on voltage was observed, which was attributed to defect-assisted tunneling-recombination. The flat-band voltage extracted from C-V is around 0.46 V, much smaller than the built-in voltage calculated for an ideal GaAs/GaN pn heterojunction. A band diagram including interface charge effects together with a possible energy barrier, stemming from a layer of disordered material at the fused GaAs/GaN interface, has been proposed to explain the experimental observations.
机译:GaAs / GaN pn异质结二极管已通过直接晶片融合制造,并具有电容-电压(C-V)测量和温度相关电流-电压(I-V)测量的特征。晶片熔化的pn二极管显示出良好的整流性能,但观察到较小的导通电压,这归因于缺陷辅助的隧穿复合。从C-V提取的平带电压约为0.46 V,比为理想GaAs / GaN pn异质结计算的内置电压小得多。已经提出了一个带界面图,该带图包括界面电荷效应以及可能的能垒,其来自于融合的GaAs / GaN界面处的无序材料层,用于解释实验观察结果。

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