机译:核壳型Ag @ SiO_2纳米颗粒填料增强聚酰亚胺基复合材料的高导热性和低介电常数
Electronic Materials Research Laboratory, Key Laboratory of Ministry of Education, Xi' an Jiaotong University, Xi'an 710049, China International Center for Dielectric Research, Xi'an Jiaotong University, Xi'an 710049, China;
Electronic Materials Research Laboratory, Key Laboratory of Ministry of Education, Xi' an Jiaotong University, Xi'an 710049, China International Center for Dielectric Research, Xi'an Jiaotong University, Xi'an 710049, China;
Key Laboratory of Thermal Fluid Science and Engineering of Ministry of Education, Xi'an Jiaotong University, Xi'an 710049, China;
Electronic Materials Research Laboratory, Key Laboratory of Ministry of Education, Xi' an Jiaotong University, Xi'an 710049, China International Center for Dielectric Research, Xi'an Jiaotong University, Xi'an 710049, China;
Electronic Materials Research Laboratory, Key Laboratory of Ministry of Education, Xi' an Jiaotong University, Xi'an 710049, China;
Electronic Materials Research Laboratory, Key Laboratory of Ministry of Education, Xi' an Jiaotong University, Xi'an 710049, China International Center for Dielectric Research, Xi'an Jiaotong University, Xi'an 710049, China;
机译:核-壳型Ag @ SiO2纳米颗粒填料增强了聚酰亚胺基复合材料的高导热性和低介电常数
机译:核心壳结构的Al / PVDF纳米复合材料具有高介电常数,但损耗低,导热性增强
机译:Ag @ SiO2核壳纳米粒子的低填充量提高了多孔有机硅基介电弹性体复合材料的性能
机译:通过使用表面改性的BATIO_3纳米颗粒增强弹性体复合材料的介电常数,导热性和机械强度
机译:包含无机纳米粒子和新型低成本碳质填料的多功能聚合物复合材料。
机译:聚酰亚胺改性的氮化铝填料在具有增强的导热性的AlN @ PI /环氧树脂复合材料中用于电子封装
机译:基于热导路自发形成的聚酰亚胺/银颗粒复合膜中的增强导热性