机译:极性对Ni / InN界面反应的影响
Department of Materials Science and Engineering, The Pennsylvania State University, University Park,Pennsylvania 16802, USA;
Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, USA,Intel, Hillsboro, Oregon 97124, USA.;
U. S. Army Research Laboratory, Sensors and Electron Devices Directorate, 2800 Powder Mill Road,Adelphi, Maryland 20783, USA,Veeco Instruments, St. Paul, Minnesota 55127, USA;
U. S. Army Research Laboratory, Sensors and Electron Devices Directorate, 2800 Powder Mill Road,Adelphi, Maryland 20783, USA;
Department of Materials Science and Engineering, The Pennsylvania State University, University Park,Pennsylvania 16802, USA,Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, USA;
机译:Ni / Se-Sn的界面反应,Ni / Se-Te,Ni / Sn-Te和Ni / Se-Sn-Te夫妇
机译:Sn-(Cu)/ Ni,Sn-(Ni)/ Cu和Sn /(Cu,Ni)系统中的界面反应
机译:MG / NI,AL / NI和AL /(NI)-AL2O3系统的液体扩散偶合中的界面反应
机译:SAC305和SAC405焊料在化学镀Ni(P)/浸金和化学镀Ni(B)/浸金表面上的界面反应
机译:在高电流密度下,极性对p(+)-Si和n(+)-Si上Ni和Ni(2)Si接触失效的极性影响。
机译:镍金属化与各种无铅焊料之间界面反应的热力学动力学综合分析
机译:Ni(Au / Ni / Cu)-SnAg-Cu焊点中的界面反应在回流焊接和热时效过程中的交互作用