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Enhancement of carrier mobility in MoS_2 field effect transistors by a SiO_2 protective layer

机译:SiO_2保护层增强MoS_2场效应晶体管中的载流子迁移率

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摘要

Molybdenum disulfide is a promising channel material for field effect transistors (FETs). In this paper, monolayer MoS_2 grown by chemical vapor deposition (CVD) was used to fabricate top-gate FETs through standard optical lithography. During the fabrication process, charged impurities and interface states are introduced, and the photoresist is not removed cleanly, which both limit the carrier mobility and the source-drain current. We apply a SiO_2 protective layer, which is deposited on the surface of MoS_2, in order to avoid the MoS_2 directly contacting with the photoresist and the ambient environment. Therefore, the contact property between the MoS_2 and the electrodes is improved, and the Coulomb scattering caused by the charged impurities and the interface states is reduced. Comparing MoS_2 FETs with and without a SiO_2 protective layer, the SiO_2 protective layer is found to enhance the characteristics of the MoS_2 FETs, including transfer and output characteristics. A high mobility of ~42.3 cm~2/V s is achieved, which is very large among the top-gate CVD-grown monolayer MoS_2 FETs.
机译:二硫化钼是用于场效应晶体管(FET)的有前途的沟道材料。在本文中,通过化学气相沉积(CVD)生长的单层MoS_2用于通过标准光学光刻技术制造顶栅FET。在制造过程中,会引入带电杂质和界面态,并且不能干净地去除光刻胶,这既限制了载流子迁移率,也限制了源漏电流。为了避免MoS_2直接与光致抗蚀剂和周围环境接触,我们在MOS_2表面上沉积了SiO_2保护层。因此,改善了MoS_2与电极之间的接触性能,并且减少了由带电杂质和界面态引起的库仑散射。比较具有和不具有SiO_2保护层的MoS_2 FET,发现SiO_2保护层可以增强MoS_2 FET的特性,包括传输和输出特性。实现了约42.3 cm〜2 / V s的高迁移率,这在顶栅CVD生长的单层MoS_2 FET中非常大。

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  • 来源
    《Applied Physics Letters》 |2016年第20期|203105.1-203105.4|共4页
  • 作者单位

    Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology (TNList), Tsinghua University, Beijing 100084, China;

    Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology (TNList), Tsinghua University, Beijing 100084, China;

    Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology (TNList), Tsinghua University, Beijing 100084, China;

    Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology (TNList), Tsinghua University, Beijing 100084, China;

    Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology (TNList), Tsinghua University, Beijing 100084, China;

    Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology (TNList), Tsinghua University, Beijing 100084, China;

    Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology (TNList), Tsinghua University, Beijing 100084, China;

    Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China;

    Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China,CollaborativeInnovation Center of Quantum Matter, Beijing 100190, China;

    Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology (TNList), Tsinghua University, Beijing 100084, China;

    Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology (TNList), Tsinghua University, Beijing 100084, China,The State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Shanghai 200050, China,Advanced Sensor and Integrated System Lab, Graduate School at Shenzhen, Tsinghua University, Shenzhen 518055, China;

    Institute of Microelectronics and Tsinghua National Laboratory for Information Science and Technology (TNList), Tsinghua University, Beijing 100084, China;

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