24-Element Antenna-in-Package for Stationary 60-GHz Communication Scenarios

摘要

An integrated multilayer antenna-in-package (AiP) targeted for stationary 60-GHz communication is presented. The key differences in design conditions for mass-market-level and prototype-level AiP are discussed and reflected during the design process. Hence, a low-cost and high-reliability package solution is realized. The proposed AiP consists of a 4 × 6 array of 24 stacked circular patch antennas and corresponding antenna feed lines designed for phased array. The finalized LTCC AiP prototype features 20 × 15 × 1.02 mm3 in dimension. Solder bump flip-chip technology is used to attach the AiP to the RFIC for system-level assembly. The assembled package is evaluated using a custom-designed near-field measurement setup. EM simulations and measurements confirm the presented AiP features more than 9 GHz bandwidth, 45° beam-steering ranges in both E- and H-planes, and more than 14.5 dBi gain at boresight.