Sensata Technologies Develops a Latched Socket

摘要

Hideyuki Takahashi, Japan engineering manager, and Hide Fu-rukawa, U.S. engineering manager at Sensata Technologies have developed a latch system for delicate IC packages. This patent-pending latch approach, with a vertical touch application, distributes the force delivered at the time of socket testing over a large area; therefore, protecting bare die, thin, PoP and stacked, and soft molded ICs. By force distribution using no horizontal movement, scratch marks and warpage on the IC can be avoided.