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Recent Progress and Future Prospects of 2D-Based Photodetectors

机译:基于二维的光电探测器的最新进展和未来展望

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摘要

Conventional semiconductors such as silicon- and indium gallium arsenide (InGaAs)-based photodetectors have encountered a bottleneck in modern electronics and photonics in terms of spectral coverage, low resolution, nontransparency, nonflexibility, and complementary metal-oxide-semiconductor (CMOS) incompatibility. New emerging two-dimensional (2D) materials such as graphene, transition metal dichalcogenides (TMDs), and their hybrid systems thereof, however, can circumvent all these issues benefitting from mechanically flexibility, extraordinary electronic and optical properties, as well as wafer-scale production and integration. Heterojunction-based photodiodes based on 2D materials offer ultrafast and broadband response from the visible to far-infrared range. Phototransistors based on 2D hybrid systems combined with other material platforms such as quantum dots, perovskites, organic materials, or plasmonic nanostructures yield ultrasensitive and broadband light-detection capabilities. Notably the facile integration of 2D photodetectors on silicon photonics or CMOS platforms paves the way toward high-performance, low-cost, broadband sensing and imaging modalities.
机译:传统的半导体,例如基于砷化硅和铟镓的铟(InGaAs)光电探测器,在光谱覆盖率,低分辨率,不透明性,非柔性以及互补金属氧化物半导体(CMOS)不兼容方面,已成为现代电子和光子学的瓶颈。然而,新兴的二维(2D)材料,例如石墨烯,过渡金属二卤化二金属(TMD)及其混合系统,可以从机械柔韧性,非凡的电子和光学特性以及晶圆规模中受益,从而规避所有这些问题生产和整合。基于2D材料的基于异质结的光电二极管可提供从可见光到远红外范围的超快速和宽带响应。基于2D混合系统的光电晶体管与其他材料平台(例如量子点,钙钛矿,有机材料或等离激元纳米结构)相结合,可产生超灵敏的宽带光检测功能。值得注意的是,在硅光子学或CMOS平台上轻松集成2D光电探测器为高性能,低成本,宽带传感和成像方式铺平了道路。

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