Photopolymerized Triazole-Based Classy Polymer Networks with Superior Tensile Toughness

摘要

Photopolymerization is a ubiquitous, indispensable technique widely applied in applications from coatings, inks, and adhesives to thermosetting restorative materials for medical implants, and the fabrication of complex macroscale, microscale, and nanoscale 3D architectures via additive manufacturing. However, due to the brittleness inherent in the dominant acrylate-based photopolymerized networks, a significant need exists for higher performance resin/oligomer formulations to create tough, defect-free, mechanically ductile, thermally and chemically resistant, high modulus network polymers with rapid photocuring kinetics. This study presents densely cross-linked triazole-based glassy photopolymers capable of achieving preeminent toughness of approximate to 70 MJ m(-3) and 200% strain at ambient temperature, comparable to conventional tough thermoplastics. Formed either via photoinitiated copper(I)-catalyzed cycloaddition of monomers containing azide and alkyne groups (CuAAC) or via photoinitiated thiol-ene reactions from monomers containing triazole rings, these triazole-containing thermosets completely recover their original dimensions and mechanical behavior after repeated deformations of 50% strain in the glassy state over multiple thermal recovery-strain cycles.