机译:用于3D电子的多合一超级电容器的单片集成
Hong Kong Polytech Univ, Dept Appl Phys, Hung Hom, Kowloon, Hong Kong, Peoples R China|Hong Kong Polytech Univ, Inst Text & Clothing, Hung Hom, Kowloon, Hong Kong, Peoples R China|Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;
Tsinghua Univ, Grad Sch Shenzhen, Div Energy & Environm, Shenzhen 518055, Peoples R China;
Hong Kong Polytech Univ, Dept Appl Phys, Hung Hom, Kowloon, Hong Kong, Peoples R China;
Hong Kong Polytech Univ, Dept Appl Phys, Hung Hom, Kowloon, Hong Kong, Peoples R China;
Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;
Univ Elect Sci & Technol China, State Key Lab Elect Thin Films & Integrated Devic, Chengdu 610054, Sichuan, Peoples R China;
Tsinghua Univ, Grad Sch Shenzhen, Div Energy & Environm, Shenzhen 518055, Peoples R China;
Hong Kong Polytech Univ, Inst Text & Clothing, Hung Hom, Kowloon, Hong Kong, Peoples R China;
Hong Kong Polytech Univ, Dept Appl Phys, Hung Hom, Kowloon, Hong Kong, Peoples R China;
3D electronics; all-in-one; heterogeneous integration; supercapacitors;
机译:一体化整合3D电子产品的一流超级电容器
机译:低温掺杂剂活化,采用纳秒超紫光激光退火用于整体三维集成
机译:ZnO / Pt接口的选择性光热调制,用于整体基于氧化物基电阻随机存取存储器的整体三维集成
机译:基于二维固相结晶的二维电子整体三维集成
机译:用于单片3D集成的硅薄膜的准分子激光结晶。
机译:通过不对称超级电容器和温度传感器的混合用于全光纤集成电子设备的3D打印光纤电极
机译:用于构建一体化超级电容器电极的3D石墨烯网络的集成组装