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Wedge indentation of a thin film on a substrate based on micromorphic plasticity

机译:基于微晶可塑性的基底上薄膜的楔形压痕

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In this article, we use the small strain micromorphic plasticity (MP) to study the wedge indentation of a thin film on a substrate and find qualitative agreement with experiments. A two-dimensional plane strain finite element formulation of the entire MP theory framework is outlined. The generalization of the radial return method for modeling the elasto-plastic deformation is presented. The numerical results show that the MP theory is capable of describing the initial fall in hardness at small depth of indentation and then the rise at larger depth for a soft film on a hard substrate. The indentation force and hardness increase with decreasing film thickness for a given depth. It is also shown that the hardness falls monotonically as the indentation depth increases and never approaches a constant for a hard film on a soft substrate. Contrary to the soft film/hard substrate system, the force and hardness diminish with decreasing film thickness for a given depth. Besides, the influences of internal length scale and hardening modulus of the film on hardness predictions are investigated.
机译:在本文中,我们使用小应变微晶可塑性(MP)来研究基板上薄膜的楔形压痕,并找到与实验定性的一致性。概述了整个MP理论框架的二维平面应变有限元公式。提出了径向回弹法用于弹塑性变形建模的一般方法。数值结果表明,MP理论能够描述在较小压痕深度处硬度的初始下降,然后在硬质基材上的软膜厚度较大时的上升。对于给定深度,压痕力和硬度随着膜厚度的减小而增加。还显示出,随着压痕深度的增加,硬度单调下降,并且对于在软基底上的硬膜而言,硬度从未达到恒定。与软膜/硬质基材系统相反,在给定深度下,力和硬度会随着膜厚度的减小而减小。此外,研究了膜的内部长度尺度和硬化模量对硬度预测的影响。

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