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Grain boundary strengthening of copper-base copper-manganese and copper-gallium solid solutions

机译:铜基铜锰和铜镓固溶体的晶界强化

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摘要

The yield strength σy of copper-base copper-manganese and copper-gallium polycrystalline solid solutions has been measured as a function of the grain size d. X-ray diffraction studies proved that the specimens had only very weak textures. The function σy(d) is well represented by the Hall-Petch re- lation, but its slope k varies strongly with the type and the concentration of the solute. That indicates that solid solution and grain boundary strengthening do not superimpose linearly.
机译:已测量了铜基铜锰和铜镓多晶固溶体的屈服强度σy与晶粒尺寸d的关系。 X射线衍射研究证明标本只有非常弱的质地。霍尔-帕奇关系很好地表示了函数σy(d),但其斜率k随溶质的类型和浓度而变化很大。这表明固溶和晶界强化不是线性叠加的。

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