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Fracture Toughness of Porous Material of LSCF in Bulk and Film Forms

机译:散装和薄膜形式的LSCF多孔材料的断裂韧性

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摘要

Fracture toughness of La0.6Sr0.4Co0.2Fe0.8O3‐δ (LSCF) in both bulk and film forms after sintering at 900°C to 1200°C was measured using both single‐edge V‐notched beam (SEVNB) 3‐point bending and Berkovich indentation. FIB/SEM slice‐and‐view observation after indentation revealed the presence of Palmqvist radial crack systems after indentation of the bulk materials. Based on crack length measurements, the fracture toughness of bulk LSCF specimens was determined to be in the range 0.54–0.99 MPa·m1/2 (depending on sintering temperature), in good agreement with the SEVNB measurements (0.57–1.13 MPa·m1/2). The fracture toughness was approximately linearly dependent on porosity over the range studied. However, experiments on films showed that the generation of observable indentation‐induced cracks was very difficult for films sintered at temperatures below 1200°C. This was interpreted as being the result of the substrate having much higher modulus than these films. Cracks were only detectable in the films sintered at 1200°C and gave an apparent toughness of 0.17 MPa·m1/2 using the same analysis as for bulk specimens. This value is much smaller than that for bulk material with the same porosity. The residual thermal expansion mismatch stress measured using XRD was found to be responsible for such a low apparent toughness.
机译:使用单边V型缺口梁(SEVNB)3点测量了在900°C至1200°C烧结后的块状和膜状La0.6Sr0.4Co0.2Fe0.8O3-δ(LSCF)的断裂韧性弯曲和Berkovich压痕。压痕后的FIB / SEM切片和观察结果表明,压入大块材料后存在Palmqvist径向裂纹系统。根据裂纹长度测量,确定大块LSCF试样的断裂韧性在0.54–0.99 MPa·m 1/2 (取决于烧结温度)的范围内,与SEVNB的测量结果非常吻合(0.57–1.13 MPa·m 1/2 )。在研究的范围内,断裂韧性近似线性地取决于孔隙率。但是,在薄膜上进行的实验表明,对于在低于1200°C的温度下烧结的薄膜,很难观察到压痕引起的裂纹的产生。可以认为这是基材具有比这些膜高得多的模量的结果。使用与散装试样相同的分析方法,只有在1200℃烧结的薄膜中才能检测到裂纹,并且其表观韧性为0.17MPa·m 1/2 。该值远小于具有相同孔隙率的散装材料的值。发现使用XRD测量的残余热膨胀失配应力是造成如此低的表观韧性的原因。

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