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Angle-Sensitive Detector Based on Silicon-On-Insulator Photodiode Stacked with Surface Plasmon Antenna

机译:基于硅 - 绝缘体光电二极管的角度敏感探测器用表面等离子体天线堆叠

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摘要

We present a pixel-level angle sensitive detector composed of silicon-on-insulator (SOI) photodiode (PD) stacked with a gold surface plasmon (SP) antenna to affect the direction of the incoming light. The surface plasmons are excited in the grating-type SP antenna and enhance the diffraction efficiency of the grating. The diffracted light is coupled strongly with the propagation light in the SOI waveguide when the phase matching condition is satisfied. The phase matching takes place at a specific angle of light incidence, and the discrimination of the light based on the incident angle is achieved. As spatial patterns in the polar coordinate of the elevation-azimuth angles (θ, ϕ) of the incident light, we present the phase matching condition theoretically, the absorption efficiency in the SOI by simulation, and also the quantum efficiency of the SOI PD experimentally for different SP antennas of one-dimensional (1D) line-and-space (L/S) and two-dimensional (2D) hole array gratings under various polarization angles. 1D grating offers a polarization sensitive angle detection and 2D grating exhibits angle detection in two orthogonal directions, enabling a polarization independent angle sensitivity. A good agreement among the theory, simulation, and experiment are attained. The proposed device features relatively high quantum efficiency as an angle-sensitive pixel (ASP) and gives wider opportunities in applications such as three-dimensional (3D) imaging, depth-of-field extension, and lensless imaging.
机译:我们提出了一种像素级角敏感检测器,由绝缘体(SOI)光电二极管(PD)组成,堆叠有金表面等离子体(SP)天线以影响入射光的方向。在光栅型SP天线中激发表面等离子体,并提高光栅的衍射效率。当相位匹配条件满足时,衍射光在SOI波导中的传播光耦合。相位匹配在特定的光入射角发生,并且实现了基于入射角的光的辨别。作为入射光的升高 - 方位角(θ,φ)的极性坐标中的空间图案,理论上,通过模拟,通过模拟呈现相位匹配的条件,通过模拟,SOI PD的量子效率对于一维(1D)线路和空间(L / S)和二维(2D)孔阵列的不同SP天线,在各种偏振角下光栅。 1D光栅提供偏振敏感角度检测和2D光栅在两个正交方向上表现出角度检测,从而实现偏振独立的角度灵敏度。达到了理论,模拟和实验之间的良好一致性。所提出的装置具有相对高的量子效率作为角度敏感像素(ASP),并且在诸如三维(3D)成像,景深扩展和无透镜成像的应用中提供更广泛的机会。

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