Heterogeneously integrated flexible microwave amplifiers on a cellulose nanofibril substrate

摘要

Schematic illustration of transforming rigid MMIC to flexible MMIC via substrate removal. A sparse array of transistors was fabricated on a semiconductor epitaxial wafer. Passive microwave components were also fabricated on the same semiconductor wafer to obtain rigid MMIC. The wafer with MMICs was flip-bonded to a temporary substrate and the original semiconductor substrate was removed. After isolating MMICs, one MMIC was picked for use with or without a new host substrate. MIC based on heterogeneous integration of membrane transistors with passives on foreign host substrate. A dense array of transistors was fabricated on a semiconductor epitaxial wafer. The transistors are released from the semiconductor wafer after forming connection metal pads. Selected transistors were deterministically transfer printed on a reusable temporary substrate and formed a sparse array on it. Passive components were fabricated on the temporary substrate and together with the transistors to form MIC. MIC is obtained after releasing the MIC from the temporary substrate.