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Piezoelectric Impedance-Based Non-Destructive Testing Method for Possible Identification of Composite Debonding Depth

机译:基于压电阻抗的无损检测方法可确定复合材料的剥离深度

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摘要

Detecting the depth and size of debonding in composite structures is essential for assessing structural safety as it can weaken the structure possibly leading to a failure. As composite materials are used in various fields up to date including aircrafts and bridges, inspections are carried out to maintain structural integrity. Although many inspection methods exist for detection damage of composites, most of the techniques require trained experts or a large equipment that can be time consuming. In this study, the possibility of using the piezoelectric material-based non-destructive method known as the electromechanical impedance (EMI) technique is used to identify the depth of debonding damage of glass epoxy laminates. Laminates with various thicknesses were prepared and tested to seek for the possibility of using the EMI technique for identifying the depth of debonding. Results show promising outcome for bringing the EMI technique a step closer for commercialization.
机译:检测复合结构中脱胶的深度和大小对于评估结构安全性至关重要,因为它会削弱结构并可能导致故障。随着复合材料在包括飞机和桥梁在内的各个领域的最新应用,进行了检查以保持结构的完整性。尽管存在许多用于检测复合材料损坏的检查方法,但是大多数技术都需要训练有素的专家或大型设备,这很耗时。在这项研究中,使用基于压电材料的非破坏性方法(称为机电阻抗(EMI)技术)的可能性来确定玻璃环氧层压板的脱粘损伤深度。制备并测试了各种厚度的层压板,以寻找使用EMI技术识别脱胶深度的可能性。结果表明,将EMI技术推向更近一步商业化的前景令人鼓舞。

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