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Catalytic activity of noble metals for metal-assisted chemical etching of silicon

机译:贵金属对硅的金属辅助化学刻蚀的催化活性

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摘要

Metal-assisted chemical etching of silicon is an electroless method that can produce porous silicon by immersing metal-modified silicon in a hydrofluoric acid solution without electrical bias. We have been studying the metal-assisted hydrofluoric acid etching of silicon using dissolved oxygen as an oxidizing agent. Three major factors control the etching reaction and the porous silicon structure: photoillumination during etching, oxidizing agents, and metal particles. In this study, the influence of noble metal particles, silver, gold, platinum, and rhodium, on this etching is investigated under dark conditions: the absence of photogenerated charges in the silicon. The silicon dissolution is localized under the particles, and nanopores are formed whose diameters resemble the size of the metal nanoparticles. The etching rate of the silicon and the catalytic activity of the metals for the cathodic reduction of oxygen in the hydrofluoric acid solution increase in the order of silver, gold, platinum, and rhodium.
机译:硅的金属辅助化学蚀刻是一种无电方法,可以通过将金属改性的硅浸没在氢氟酸溶液中而没有电偏压来生产多孔硅。我们一直在研究使用溶解氧作为氧化剂对硅进行金属辅助的氢氟酸蚀刻。控制蚀刻反应和多孔硅结构的三个主要因素是:蚀刻过程中的光照射,氧化剂和金属颗粒。在这项研究中,在黑暗条件下研究了贵金属颗粒,银,金,铂和铑对这种蚀刻的影响:硅中不存在光生电荷。硅溶解位于颗粒下方,并且形成了纳米孔,其直径类似于金属纳米颗粒的大小。硅的蚀刻速率和金属对氢氟酸溶液中氧的阴极还原的催化活性按银,金,铂和铑的顺序增加。

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