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Printed Diodes: Materials Processing Fabrication and Applications

机译:印刷二极管:材料加工制造和应用

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摘要

Printing techniques for the fabrication of diodes have received increasing attention over the last decade due to their great potential as alternatives for high‐throughput and cost‐effective manufacturing approaches compatible with both flexible and rigid substrates. Here, the progress achieved and the challenges faced in the fabrication of printed diodes are discussed and highlighted, with a focus on the materials of significance (silicon, metal oxides, nanomaterials, and organics), the techniques utilized for ink deposition (gravure printing, screen printing, inkjet printing, aerosol jet printing, etc.), and the process through which the printed layers of diode are sintered after printing. Special attention is also given to the device applications within which the printed diodes have been successfully incorporated, particularly in the fields of rectification, light emission, energy harvesting, and displays. Considering the unmatched production scalability of printed diodes and their intrinsic suitability for flexible and wearable applications, significant improvement in performance and intensive research in development and applications of the printed diodes will continuously progress in the future.
机译:在过去的十年中,用于二极管制造的印刷技术作为与柔性和刚性基板兼容的高通量和具有成本效益的制造方法的替代品,具有巨大的潜力,因此受到越来越多的关注。在此,我们重点讨论了重要的材料(硅,金属氧化物,纳米材料和有机物),用于墨水沉积的技术(凹版印刷,丝网印刷,喷墨印刷,气溶胶喷射印刷等),以及在印刷后烧结二极管的印刷层的过程。还特别注意了已成功集成印刷二极管的设备应用,特别是在整流,发光,能量收集和显示领域。考虑到印刷二极管无与伦比的生产可扩展性及其对柔性和可穿戴应用的内在适应性,性能的显着提高以及对印刷二极管的开发和应用的深入研究将在未来不断发展。

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