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Design of exceptionally strong and conductive Cu alloys beyond the conventional speculation via the interfacial energy-controlled dispersion of γ-Al2O3 nanoparticles

机译:通过界面能控制的γ-Al2O3纳米粒子的分散设计出超越常规推测的超强导电铜合金

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摘要

The development of Cu-based alloys with high-mechanical properties (strength, ductility) and electrical conductivity plays a key role over a wide range of industrial applications. Successful design of the materials, however, has been rare due to the improvement of mutually exclusive properties as conventionally speculated. In this paper, we demonstrate that these contradictory material properties can be improved simultaneously if the interfacial energies of heterogeneous interfaces are carefully controlled. We uniformly disperse γ-Al2O3 nanoparticles over Cu matrix, and then we controlled atomic level morphology of the interface γ-Al2O3//Cu by adding Ti solutes. It is shown that the Ti dramatically drives the interfacial phase transformation from very irregular to homogeneous spherical morphologies resulting in substantial enhancement of the mechanical property of Cu matrix. Furthermore, the Ti removes impurities (O and Al) in the Cu matrix by forming oxides leading to recovery of the electrical conductivity of pure Cu. We validate experimental results using TEM and EDX combined with first-principles density functional theory (DFT) calculations, which all consistently poise that our materials are suitable for industrial applications.
机译:具有高机械性能(强度,延展性)和导电性的铜基合金的开发在广泛的工业应用中起着关键作用。然而,由于传统推测的互斥特性的改进,成功的材料设计很少见。在本文中,我们证明,如果仔细控制异质界面的界面能,可以同时改善这些矛盾的材料性能。我们将γ-Al2O3纳米颗粒均匀分散在Cu基体上,然后通过添加Ti溶质来控制γ-Al2O3// Cu界面的原子级形态。结果表明,Ti极大地驱动了界面相从非常不规则的球形过渡到均匀的球形形态,从而大大提高了Cu基体的机械性能。此外,Ti通过形成氧化物而去除了Cu基体中的杂质(O和Al),从而恢复了纯Cu的电导率。我们使用TEM和EDX结合第一原理密度泛函理论(DFT)计算来验证实验结果,这些结果始终表明我们的材料适用于工业应用。

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