首页> 美国卫生研究院文献>Scientific Reports >Thermal Conductance of the 2D MoS2/h-BN and graphene/h-BN Interfaces
【2h】

Thermal Conductance of the 2D MoS2/h-BN and graphene/h-BN Interfaces

机译:二维MoS2 / h-BN和石墨烯/ h-BN界面的热传导

代理获取
本网站仅为用户提供外文OA文献查询和代理获取服务,本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文,但由于OA文献来源多样且变更频繁,仍可能出现获取不到、文献不完整或与标题不符等情况,如果获取不到我们将提供退款服务。请知悉。

摘要

Two-dimensional (2D) materials and their corresponding van der Waals heterostructures have drawn tremendous interest due to their extraordinary electrical and optoelectronic properties. Insulating 2D hexagonal boron nitride (h-BN) with an atomically smooth surface has been widely used as a passivation layer to improve carrier transport for other 2D materials, especially for Transition Metal Dichalcogenides (TMDCs). However, heat flow at the interface between TMDCs and h-BN, which will play an important role in thermal management of various electronic and optoelectronic devices, is not yet understood. In this paper, for the first time, the interface thermal conductance (G) at the MoS2/h-BN interface is measured by Raman spectroscopy, and the room-temperature value is (17.0 ± 0.4) MW · m−2K−1. For comparison, G between graphene and h-BN is also measured, with a value of (52.2 ± 2.1) MW · m−2K−1. Non-equilibrium Green’s function (NEGF) calculations, from which the phonon transmission spectrum can be obtained, show that the lower G at the MoS2/h-BN interface is due to the weaker cross-plane transmission of phonon modes compared to graphene/h-BN. This study demonstrates that the MoS2/h-BN interface limits cross-plane heat dissipation, and thereby could impact the design and applications of 2D devices while considering critical thermal management.
机译:二维(2D)材料及其相应的范德华异质结构因其非凡的电气和光电特性而引起了极大的兴趣。具有原子光滑表面的2D六方氮化硼六方氮化硼(h-BN)绝缘已被广泛用作钝化层,以改善其他2D材料(尤其是过渡金属二硫属化物)(TMDC)的载流子传输。然而,在TMDC和h-BN之间的界面处的热流将在各种电子和光电设备的热管理中起重要作用,目前尚不清楚。本文首次通过拉曼光谱法测量了MoS2 / h-BN界面的界面导热系数(G),室温值为(17.0±0.4)MW·m -2 K −1 。为了比较,还测量了石墨烯和h-BN之间的G,其值为(52.2±2.1)MW·m -2 K -1 。非平衡格林函数(NEGF)计算(可从中获得声子透射光谱)表明,与石墨烯/ h相比,MoS2 / h-BN界面处的G较低是由于声子模式的跨平面透射较弱-BN。这项研究表明,MoS2 / h-BN接口限制了跨平面的散热,因此在考虑关键的热管理时可能会影响2D设备的设计和应用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
代理获取

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号