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Improved thermoelectric performance of solid solution Cu4Sn7.5S16 through isoelectronic substitution of Se for S

机译:通过硒等电取代硒提高固溶体Cu4Sn7.5S16的热电性能

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摘要

Cu-Sn-S family of compounds have been considered as very competitive thermoelectric candidates in recent years due to their abundance and eco-friendliness. The first-principles calculation reveals that the density of states (DOS) increases in the vicinity of the Fermi level (Ef) upon an incorporation of Se in the Cu4Sn7.5S16−xSex (x = 0–2.0) system, which indicates the occurrence of resonant states. Besides, the formation of Cu(Sn)-Se network upon the occupation of Se in S site reduces the Debye temperature from 395 K for Cu4Sn7S16 (x = 0) to 180.8 K for Cu4Sn7.5S16−xSex (x = 1.0). Although the point defects mainly impact the phonon scattering, an electron-phonon interaction also bears significance in the increase in phonon scattering and the further reducion of lattice thermal conductivity at high temperatures. As a consequence, the resultant TE figure of merit (ZT) reaches 0.5 at 873 K, which is 25% higher compared to 0.4 for Cu4Sn7.5S16.
机译:近年来,由于Cu-Sn-S系列化合物的丰富性和生态友好性,它们被认为是极具竞争力的热电候选物。第一性原理计算表明,在Cu4Sn7.5S16-xSex(x = 0-2.0)系统中掺入Se后,费米能级(Ef)附近的态密度(DOS)增大。共振态。此外,由于在S位点上占据了Se而形成了Cu(Sn)-Se网络,从而将德拜温度从Cu4Sn7S16(x = 0)的395 K降低到Cu4Sn7.5S16-xSex(x = 1.0)的180.8K。尽管点缺陷主要影响声子的散射,但电子-声子的相互作用在声子散射的增加以及高温下晶格热导率的进一步降低中也具有重要意义。结果,得到的TE品质因数(ZT)在873 K达到0.5,比Cu4Sn7.5S16的0.4更高25%。

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