This paper presents a new methodology for detecting and quantifying delamination in composite plates based on the high-frequency local vibration under the excitation of piezoelectric wafer active sensors. Finite-element-method-based numerical simulations and experimental measurements were performed to quantify the size, shape, and depth of the delaminations. Two composite plates with purpose-built delaminations of different sizes and depths were analyzed. In the experiments, ultrasonic C-scan was applied to visualize the simulated delaminations. In this methodology, piezoelectric wafer active sensors were used for the high-frequency excitation with a linear sine wave chirp from 1 to 500 kHz and a scanning laser Doppler vibrometer was used to measure the local vibration response of the composite plates. The local defect resonance frequencies of delaminations were determined from scanning laser Doppler vibrometer measurements and the corresponding operational vibration shapes were measured and utilized to quantify the delaminations. Harmonic analysis of local finite element model at the local defect resonance frequencies demonstrated that the strong vibrations only occurred in the delamination region. It is shown that the effect of delamination depth on the detectability of the delamination was more significant than the size of the delamination. The experimental and finite element modeling results demonstrate a good capability for the assessment of delamination with different sizes and depths in composite structures.
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