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A 250 m Direct Time-of-Flight Ranging System Based on a Synthesis of Sub-Ranging Images and a Vertical Avalanche Photo-Diodes (VAPD) CMOS Image Sensor

机译:基于子测距图像和垂直雪崩光电二极管(VAPD)CMOS图像传感器的合成的250 m直接飞行时间测距系统

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摘要

We have developed a direct time-of-flight (TOF) 250 m ranging Complementary Metal Oxide Semiconductor (CMOS) image sensor (CIS) based on a 688 × 384 pixels array of vertical avalanche photodiodes (VAPD). Each pixel of the CIS comprises VAPD with a standard four transistor pixel circuit equipped with an analogue capacitor to accumulate or count avalanche pulses. High power near infrared (NIR) short (<50 ns) and repetitive (6 kHz) laser pulses are illuminated through a diffusing optics. By globally gating the VAPD, each pulse is counted in the in-pixel counter enabling extraction of sub-photon level signal. Depth map imaging with a 10 cm lateral resolution is realized from 1 m to 250 m range by synthesizing subranges images of photon counts. Advantages and limitation of an in-pixel circuit are described. The developed CIS is expected to supersede insufficient resolution of the conventional light detection and ranging (LiDAR) systems and the short range of indirect CIS TOF.
机译:我们基于688×384像素的垂直雪崩光电二极管(VAPD)阵列,开发了直接飞行时间(TOF)250 m的互补金属氧化物半导体(CMOS)图像传感器(CIS)。 CIS的每个像素都包括VAPD,该像素带有标准的四晶体管像素电路,该电路配备有模拟电容器以累积或计数雪崩脉冲。高功率近红外(NIR)短(<50 ns)和重复(6 kHz)激光脉冲通过漫射光学器件照明。通过全局选通VAPD,每个脉冲在像素内计数器中计数,从而能够提取亚光子级信号。通过合成光子计数的子范围图像,可以在1 m至250 m范围内实现横向分辨率为10 cm的深度图成像。描述了像素内电路的优点和局限性。预计已开发的CIS将取代传统光检测和测距(LiDAR)系统的分辨率不足以及间接CIS TOF的短距离。

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