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An Improved Equivalent Simulation Model for CMOS Integrated Hall Plates

机译:CMOS集成霍尔板的改进等效仿真模型

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摘要

An improved equivalent simulation model for a CMOS-integrated Hall plate is described in this paper. Compared with existing models, this model covers voltage dependent non-linear effects, geometrical effects, temperature effects and packaging stress influences, and only includes a small number of physical and technological parameters. In addition, the structure of this model is relatively simple, consisting of a passive network with eight non-linear resistances, four current-controlled voltage sources and four parasitic capacitances. The model has been written in Verilog-A hardware description language and it performed successfully in a Cadence Spectre simulator. The model’s simulation results are in good agreement with the classic experimental results reported in the literature.
机译:本文介绍了一种改进的CMOS集成霍尔板等效仿真模型。与现有模型相比,该模型涵盖了电压相关的非线性效应,几何效应,温度效应和封装应力影响,并且仅包括少量物理和技术参数。此外,该模型的结构相对简单,由具有八个非线性电阻,四个电流控制电压源和四个寄生电容的无源网络组成。该模型已用Verilog-A硬件描述语言编写,并在Cadence Spectre模拟器中成功执行。该模型的仿真结果与文献中报道的经典实验结果非常吻合。

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