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Effects of Annealing on the Residual Stress in γ-TiAl Alloy by Molecular Dynamics Simulation

机译:分子动力学模拟研究退火对γ-TiAl合金残余应力的影响

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摘要

In this paper, molecular dynamics simulations are performed to study the annealing process of γ-TiAl alloy with different parameters after introducing residual stress into prepressing. By mainly focusing on the dynamic evolution process of microdefects during annealing and the distribution of residual stress, the relationship between microstructure and residual stress is investigated. The results show that there is no phase transition during annealing, but atom distortion occurs with the change of temperature, and the average grain size slightly increases after annealing. There are some atom clusters in the grains, with a few point defects, and the point defect concentration increases with the rise in temperature, and vice versa; the higher the annealing temperature, the fewer the point defects in the grain after annealing. Due to the grain boundary volume shrinkage and and an increase in the plastic deformation of the grain boundaries during cooling, stress is released, and the average residual stress along Y and Z directions after annealing is less than the average residual stress after prepressing.
机译:本文通过分子动力学模拟研究了将残余应力引入预压后不同参数的γ-TiAl合金的退火过程。通过重点研究退火过程中微缺陷的动态演化过程和残余应力的分布,研究了微观结构与残余应力之间的关系。结果表明,退火过程中没有相变,但是随着温度的变化原子发生畸变,退火后平均晶粒尺寸略有增加。晶粒中有一些原子簇,具有少量的点缺陷,并且随着温度的升高,点缺陷的浓度增加,反之亦然。退火温度越高,退火后晶粒中的点缺陷越少。由于晶界体积的收缩和冷却过程中晶界塑性变形的增加,应力得以释放,退火后沿Y和Z方向的平均残余应力小于预压后的平均残余应力。

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