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Transformation-Induced Relaxation and Stress Recovery of TiNi Shape Memory Alloy

机译:TiNi形状记忆合金的相变诱导弛豫和应力恢复

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摘要

The transformation-induced stress relaxation and stress recovery of TiNi shape memory alloy (SMA) in stress-controlled subloop loading were investigated based on the local variation in temperature and transformation band on the surface of the tape in the tension test. The results obtained are summarized as follows. (1) In the loading process, temperature increases due to the exothermic martensitic transformation (MT) until the holding strain and thereafter temperature decreases while holding the strain constant, resulting in stress relaxation due to the MT; (2) In the unloading process, temperature decreases due to the endothermic reverse transformation until the holding strain and thereafter temperature increases while holding the strain constant, resulting in stress recovery due to the reverse transformation; (3) Stress varies markedly in the initial stage followed by gradual change while holding the strain constant; (4) If the stress rate is high until the holding strain in the loading and unloading processes, both stress relaxation and stress recovery are large; (5) It is important to take into account this behavior in the design of SMA elements, since the force of SMA elements varies even if the atmospheric temperature is kept constant.
机译:在张力测试中,基于温度和带表面上的相变带的局部变化,研究了在应力控制的子回路载荷下TiNi形状记忆合金(SMA)的相变诱导应力松弛和应力恢复。获得的结果总结如下。 (1)在加载过程中,由于放热马氏体相变(MT)导致温度升高,直到保持应变,此后在保持应变恒定的同时温度降低,从而由于MT导致应力松弛; (2)在卸载过程中,由于吸热逆相变导致温度降低,直到保持应变,然后在保持应变恒定的同时温度升高,由于逆相变导致应力恢复; (3)在保持应变不变的情况下,应力在初始阶段显着变化,然后逐渐变化; (4)如果在加载和卸载过程中直到保持应变之前应力率很高,则应力松弛和应力恢复都很大; (5)在SMA元件的设计中必须考虑到这种行为,因为即使大气温度保持恒定,SMA元件的力也会发生变化。

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