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Understanding the Electronic Structure of Metal/SAM/Organic−Semiconductor Heterojunctions

机译:了解金属/ SAM /有机半导体异质结的电子结构

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摘要

Computational modeling is used to describe the mechanisms governing energy level alignment between an organic semiconductor (OSC) and a metal covered by various self-assembled monolayers (SAMs). In particular, we address the question to what extent and under what circumstances SAM-induced work-function modifications lead to an actual change of the barriers for electron and hole injection from the metal into the OSC layer. Depending on the nature of the SAM, we observe clear transitions between Fermi level pinning and vacuum-level alignment regimes. Surprisingly, although in most cases the pinning occurs only when the metal is present, it is not related to charge transfer between the electrode and the organic layer. Instead, charge rearrangements at the interface between the SAM and the OSC are observed, accompanied by a polarization of the SAM.
机译:计算建模用于描述控制有机半导体(OSC)与被各种自组装单层(SAM)覆盖的金属之间的能级对齐的机制。特别是,我们解决了以下问题:在何种程度上以及在什么情况下,SAM引起的功函数修改会导致电子和空穴从金属注入OSC层的势垒发生实际变化。根据SAM的性质,我们观察到费米能级钉扎和真空能级对齐方式之间有明显的过渡。出乎意料的是,尽管在大多数情况下仅在存在金属时才发生钉扎,但这与电极和有机层之间的电荷转移无关。取而代之的是,观察到SAM和OSC之间的界面处的电荷重排,并伴有SAM的极化。

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