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Effective Surface Passivation of InP Nanowires byAtomic-Layer-Deposited Al2O3 with POx Interlayer

机译:InP纳米线的有效表面钝化带有POx夹层的原子层沉积Al2O3

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摘要

III/V semiconductor nanostructures have significant potential in device applications, but effective surface passivation is critical due to their large surface-to-volume ratio. For InP such passivation has proven particularly difficult, with substantial depassivation generally observed following dielectric deposition on InP surfaces. We present a novel approach based on passivation with a phosphorus-rich interfacial oxide deposited using a low-temperature process, which is critical to avoid P-desorption. For this purpose we have chosen a POx layer deposited in a plasma-assisted atomic layer deposition (ALD) system at room temperature. Since POx is known to be hygroscopic and therefore unstable in atmosphere, we encapsulate this layer with a thin ALD Al2O3 capping layer to form a POx/Al2O3 stack. This passivation scheme is capable of improving the photoluminescence (PL) efficiency of our state-of-the-art wurtzite (WZ) InP nanowires by a factor of ∼20 at low excitation. If we apply the rate equation analysis advocated by some authors, we derive a PL internal quantum efficiency (IQE) of 75% for our passivated wires at high excitation. Our resultsindicate that it is more reliable to calculate the IQE as the ratioof the integrated PL intensity at room temperature to that at 10 K.By this means we derive an IQE of 27% for the passivated wires athigh excitation (>10 kW cm–2), which constitutesan unprecedented level of performance for undoped InP nanowires. Thisconclusion is supported by time-resolved PL decay lifetimes, whichare also shown to be significantly higher than previously reportedfor similar wires. The passivation scheme displays excellent long-termstability (>7 months) and is additionally shown to substantiallyimprovethe thermal stability of InP surfaces (>300 °C), significantlyexpanding the temperature window for device processing. Such effectivesurface passivation is a key enabling technology for InP nanowiredevices such as nanolasers and solar cells.
机译:III / V半导体纳米结构在设备应用中具有巨大潜力,但有效的表面钝化因其大的表面体积比而至关重要。对于InP,这种钝化已被证明特别困难,通常在InP表面进行电介质沉积后会观察到大量的钝化。我们提出了一种基于钝化的新型方法,该钝化是使用低温工艺沉积的富含磷的界面氧化物,这对于避免P解吸至关重要。为此,我们选择了在室温下在等离子体辅助原子层沉积(ALD)系统中沉积的POx层。由于已知POx具有吸湿性,因此在大气中不稳定,因此我们用薄的ALD Al2O3覆盖层封装该层以形成POx / Al2O3叠层。这种钝化方案能够在低激发下将我们最新的纤锌矿(WZ)InP纳米线的光致发光(PL)效率提高约20倍。如果我们采用一些作者提倡的速率方程分析,我们得出的钝化线在高激发下的PL内部量子效率(IQE)为75%。我们的结果表示将IQE计算为比率更可靠室温下的PL积分强度与10 K下的PL强度的关系。通过这种方法,我们得出钝化线的IQE为27%高激发(> 10 kW cm –2 ),由未掺杂的InP纳米线具有前所未有的性能水平。这个结论由时间分辨的PL衰减寿命支持,还显示出明显高于以前的报告用于类似的电线。钝化方案显示出优异的长期性稳定性(> 7个月),并显示出提高InP表面的热稳定性(> 300°C)扩大温度窗口以进行设备处理。这么有效表面钝化是InP纳米线的关键启用技术纳米激光和太阳能电池等设备。

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