无铅化PCB工艺特点和表面材料研究

摘要

The lead-free PCB surface gets a variety of forms, including I-Sn, I-Ag, and I-Au and organic welding protection, and PCB technology includes electroplating, electroless plating and hot-dip. Different process has different advantages and disadvantages. For different lead-free surface material, its compatibility of technology and material is different. This article analyzes the PCB surface technology from the productive, manufacturing and matching, matches the material and craft through the reliability evaluation.%无铅化的PCB表层有多种形式,包括浸锡、浸银、浸金和有机焊接保护等,而PCB工艺技术包括电镀、化学镀和浸镀等多种方式.不同的工艺具有不同的优缺点,针对于不同的无铅化表层材料,其工艺与材料的兼容性也不同.本文主要从可生产性、制造型和匹配性等方面进行PCB表层技术进行分析,通过对可靠性的评估进行材料与工艺的匹配.