以苯基乙烯基硅树脂、苯基乙烯基硅油、含氢硅油、增粘剂等为原料，制成了双组分加成型高折射率LED封装胶。研究了原料对其耐高低温冲击性能的影响。结果表明：在苯基乙烯基硅树脂中引入5％的γ-环氧丙氧基丙基三甲氧基硅烷、配胶时将黏度为5000 mPa· s和300 mPa· s的苯基乙烯基硅油按10∶2的质量比混合使用、交联剂采用活性氢质量分数为0.43％的苯基含氢硅油、增粘剂含环氧基和氢基的预聚物的质量分数为1％，按此配方配成的LED封装胶用于5050、5730灯架进行测试，完全固化后先过3次回流焊，然后在-40～＋100℃的冷热冲击测试试验机中进行测试，经过500个循环后，封装胶无裂胶、胶脱底和胶片脱落、死灯等现象。%A two-component addition cure LED encapsulation adhesive with high refractive index was pre -pared by phenyl vinyl silicone resin , phenyl vinyl silicone oil , hydrogen-containing silicone oil and tackifier , etc.The effect of the materials on the impact at both high and low temperatures was studied .The material was formulated by adding 5 to 10%of KH 560 into a phenyl vinyl silicone resin , then a mixture of phenyl vinyl silicone oil with a viscosity of 5 , 000 mPa · s and 300 mPa · s respectively at a mass ratio of 10∶2 , 0.43%active hydrogen of phenyl silicone oil as the crosslinker , and 1%epoxy and hydrogen-containing prepolymer as the tackifier.Results showed that the LED encapsulant still kept working in the absence of cracks and glue off the bottom and the film when it was used for 5050 and 5730 lighthouse testing after fully cured , three times re-flow soldering , and then in high-low temperature impact tester from -40℃to 100℃after 500 times cold-hot cycles.
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