The paper reports an electroless method to prepare Ni-Mo-Cr-P alloy depositions.Italso studiesthe structure and anti-corrosion behaviors with the increase of the heat-treatment temperature,andcarriesout further analysis regarding the reasons.The results show the as-deposited Ni-Mo-Cr-P films are amorphous state,but the Ni3P phase is emerged at 300 ℃ and more crystalline Ni is generated at 400 ℃.Nickel is fully crystallized at 500 ℃ and Cr1.12Ni2.88is evolved.Additionally,there are Cr2Ni3,CuNi,Cu3.8Ni and Mo1.24Ni0.76formed at 600 ℃,while Cu0.81 Ni0.19,MoNi3and Ni3P are re-crystallized at 700 ℃ with the formation of oxide layer (NiO) on the depositions.The electrochemical analysis reveals the as-deposited Ni-Mo-Cr-P alloy films see better performance of anti-corrosion than Ni-P and Ni-Mo-P depositions.Moreover,the anti-corrosion of Ni-Mo-Cr-P is further enhanced after the crystallization at 400 ℃ and higher heattreatment temperature will lead to the inferior anti-corrosion performance.%用化学镀工艺获得了Ni-Mo-Cr-P合金镀层,研究了Ni-Mo-Cr-P非晶态合金膜随晶化处理温度升高,其结构以及耐蚀性的变化规律,并对变化的原因进行了分析.结果表明,镀态Ni-Mo-Cr-P为非晶态镀层,300 ℃时Ni3P渐渐开始析出;400℃时Ni3P相继续析出,Ni衍射峰变得较为尖锐;500℃,Ni晶化较为完全,同时出现新相Cr1.12Ni2.88;600℃有Cr2 Ni3,CuNi,Cu3.8Ni和M01.24Ni0.76生成;700℃时出现Cu0.81Ni0.19和MoNi3,Ni3P发生再结晶,同时镀层开始氧化生成NiO.电化学分析显示,镀态下Ni-Mo-Cr-P合金镀层的耐腐蚀性能优于Ni-P、Ni-Mo-P镀层;400℃下进行晶化处理,Ni-Mo-Cr-P镀层的耐腐蚀性有所提高,更高温度下的晶化处理,都会损害合金镀层的耐腐蚀性.
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