电镀中Cu2＋离子浓度随时间的变化

摘要

引见了电镀等效电路这个全新的概念，从而开启了电镀等效电路这种分析方法在电镀中应用的先河，并结合能斯特公式、法拉第定律、菲克定律并行地讨论了在恒电位阶跃下镀液里的Cu2＋铜离子浓度随时间的变化规律。%In this thesis, we introduced bran-new concept of electroplating equivalent current and opened an precedent applied in electroplate by this kind of analytical method electroplating equivalent current, and combined formula of Nernst, law of Faraday, law of Fick and discussed the evolutional discipline which cupreous ionic（Cu2＋） concentration with the variety of time in electro-solution under equipotential unit-step collaterally.