采用铸造-挤压复合法制备60 mm×30 mm×8 mm× R4 mm的Al/Cu复合材料,利用扫描电子显微镜(SEM)和能谱(EDS)分析手段分析了Al/Cu复合界面组织和相组成以及Al、Cu元素浓度在界面处的渐变过程.研究了工艺参数对Al/Cu复合界面结合层的影响,并对复合工艺参数进行了优化.结果表明:在适当的预处理工艺条件下,在铝液浇铸温度720℃,铜管的预热温度300℃时,可以获得界面复合良好、导电性能最佳的Al/Cu复合材料,其体积电阻率达到1.95×10-8Ω·m.%Al/Cu compound materials with size of 60mm × 30mm × 8mm × R4mm were fabricated by Casting-Extrusion method.The microstructures,interface and phase constituents of this composite with a gradual process of Al,Cu element concentration were analyzed by scanning electron microscope (SEM) and energy dispersive spectrometer (EDS).According to the study of the effects of the processing parameters on Al/Cu interfaces,the bonding process parameters were optimized.The results show that the well-bonded interface with a transition layer can be obtained as the Cu pipe pre-treated in a mix solution is at 300 ℃ and the pouring temperature of molten aluminum is at 720 ℃,whose volume resistivity is 1.95 × 10-8 Ω · m.
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