首页> 中文期刊> 《纳米技术与精密工程》 >Study of material removal behavior on R-plane of sapphire during ultra-precision machining based on modified slip-fracture model

Study of material removal behavior on R-plane of sapphire during ultra-precision machining based on modified slip-fracture model

         

摘要

In this paper, the modified slip/fracture activation model has been used in order to understand the mechanism of ductile-brittle transition on the R-plane of sapphire during ultra-precision machining by reflecting direction of resultant force. Anisotropic characteristics of crack morphology and ductility of machining depending on cutting direction were explained in detail with modified fracture cleavage and plastic deformation parameters. Through the analysis, it was concluded that crack morphologies were mainly determined by the interaction of multiple fracture systems activated while, critical depth of cut was determined by the dominant plastic deformation parameter. In addition to this, by using proportionality relationship between magnitude of resultant force and depth of cut in the ductile region, an empirical model for critical depth of cut was developed.

著录项

  • 来源
    《纳米技术与精密工程》 |2020年第3期|141-155|共15页
  • 作者单位

    Department of Mechanical Engineering University of Wisconsin-Madison 1513 University Avenue Madison WI 53706 United States of America;

    Department of Mechanical Engineering University of Wisconsin-Madison 1513 University Avenue Madison WI 53706 United States of America;

    b School of Aerospace and Mechanical Engineering Korea Aerospace University 76 Hanggongdaehak-ro Deogyang-gu Goyang-si Gyeonggi-do 10540 Republic of Korea;

    Department of Mechanical Engineering University of Wisconsin-Madison 1513 University Avenue Madison WI 53706 United States of America;

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  • 正文语种 eng
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