膏体充填技术现状及趋势

摘要

Paste backfill technology appears with the key backfill equipment breakthrough and the underground mining requirement,and then is rapidly promoted and applied in our country.With the application of this technology gradually mature, it is moving toward a fine research direction to improve the backfill quality and reduce the backfill cost.Definition of paste backfill,and its process characteristics and technical advantages are successively described.The development history of paste backfill technology at home and abroad,and its application status are introduced.The research status on new binder,dewatering of full tailings,paste rheology,multi-field property and micro-property of hard paste are analyzed,respectively.Meanwhile,two paste backfill systems at Xinjiang Jiashi Copper Mine and Zambia Chambishi Copper Mine are demonstrated.Finally,the devel-opment tendency of paste backfill technology in China is proposed.%膏体充填技术是充填关键设备突破和井下采矿需求共同发展的产物，该技术在我国得到迅速推广应用。随着膏体技术应用逐渐成熟，其正朝着精细化研究方向发展，旨在提高充填质量、降低充填成本。叙述了膏体充填概念、工艺特点及技术优势，介绍了膏体充填技术在国内外的发展历程和应用现状。对新型胶凝材料、全尾砂脱水技术、膏体流变学、硬化膏体多场性能和膏体微观性能等热点方向研究现状进行了分析。同时，对新疆伽师铜矿和赞比亚谦比希铜矿膏体充填系统做了介绍。最后，提出了膏体充填技术在中国的发展趋势。