针对半导体真空腔体静态密封中存在的泄漏及高温时密封圈受损等密封性问题,重新对密封圈的选择和密封槽的设计计算进行了完善,并对完善后的真空腔体的密封性进行了一系列的检漏测试及探讨,从而证明了改善方案的可行性。%This article focused on solving the problems of static sealing which caused the air leak and the O-ring damaging at high temperature in semiconductor vacuum chamber by choosing the O-ring and improving the sealing groove .Through further studying and a series of air leak test of the improved vacuum chamber ,it is proved that the improved solution is feasible .
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