采用了一种硼酸盐系无铅封接焊料，用真空炉对焊料进行熔融试验。采用单因素分析法，控制封接加热时间，改变封接温度，通过对该焊料的金相组织试验和硬度试验，得出该无铅焊料最佳的封接温度。%In this paper ,a borate lead‐free sealing solder is applied to vacuum glass sealing ,which is melted in a vacuum furnace for melting test ,and the single factor analysis method is used to analyze the influence of the sealing temperature on the sealing performance by controlling sealing heating time and changing the sealing temperature .The best sealing temperature of the lead‐free solder is obtained through the microstructure analysis and hardness test of the solder .
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